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Kalrez® perfluoroelastomer parts have been field-proven in the manufacture of semiconductors where processing steps can involve extremes of both thermal and chemical exposure. Since purity is critical to high semiconductor wafer yield, reducing semiconductor seal contamination from particulates, outgassing and extractables is a major goal of semiconductor fabricators. With Kalrez®, manufacturers gain seal integrity and process purity.
Chemical resistance that is nearly universal, coupled with superior high-temperature properties, enables Kalrez® parts to withstand virtually any process media, including plasma with various gases at temperatures up to 325°C.
By selecting the product for Kalrez® parts that is best suited to a specific application, processors can improve semiconductor seal performance in all wafer-fabricating operations, including thermal, deposition, etching, ashing/stripping, and wet chemical processes.
| Process Environment |
Kalrez® 9100 |
Kalrez® 9300 |
Kalrez® 9500 |
Kalrez® 8900 |
Kalrez® 6375UP |
| HDPCVD/PECVD/ALD |
Suggested |
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| SACVD |
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Suggested |
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| Etch |
|
Suggested |
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| Ash/Strip |
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|
Suggested |
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| Thermal |
| | |
Suggested |
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| Wet |
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Suggested |
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Users of Kalrez® have the assurance of quality and traceability of all parts made at the company's ISO 9001/9002 and AS 9100-registered facilities in the U.S. and Japan. No other high performance seal manufacturer offers this total control over product quality and end-use applications.
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